Chip Antenna
RF Bottom Pad
Nordic nR54L15
Bluetooth® 6.0 Low Energy
Thread 1.3
Zigbee PRO 2023
Zigbee 3.0
Embedded Module

PAN B611

The PAN B611-1 is a Bluetooth 6.0 Low Energy (LE) module based on the Nordic nRF54L15 single chip controller.

It is available with an on-board chip antenna or external antenna via bottom for easy design-in and facilitated end-certification. The all-in-one SoC including a superset of the most prominent nRF54 Series features combined with more performance and memory, while minimizing current consumption. In addition, the ultra-low current consumption of the PAN B611-1 makes the module an ideal choice for battery powered devices. The small size hybrid castellated holes & LGA footprint design offers the possibility for optical outgoing inspection, 2-layers designs and fast prototyping with hand soldering, while still offering more GPIOs on the bottom if needed.

PAN B611-1 Product Specification

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Bluetooth 6.0 + 802.15.4
Nordic nR54L15
Antenna Options
Chip Antenna or External Antenna
Hybrid Footprint
Castellated holes & LGA
Assembly Options
32kHz Crystal & 4MB Flash
Information

Technical Specs

The following technical specifications provide an overview of interfaces, radio standards and other key features of the module.

Integrated CircuitNordic nRF54L15
RF categoryBluetooth 6.0 & 802.15.4
MicrocontrollerARM Cortex M33 (128 MHz)
Memory1.5MB Flash and 256kB RAM
SoftwarenRF Connect SDK and Bare Metal SDK
Tx power max+8 dBm
Rx sensitivity-96 dBm @1Mb/s, -104 dBm @125kb/s
Power supply1.7 to 3.6 V
Power consumption Tx4.8 mA @0dBm
Power consumption Rx3.3 mA
Power consumption sleep 0.6 µA (wake on reset)
InterfacesUp to 32× General Purpose I/Os (GPIO) at 1.7 V, to 3.6 V, which are shared by SPI, I²C, UART, PWM, ADC (up to 14-bit), NFC, QSPI 
Operating temperature-40 to +85 °C
Size (l x w x h) 10.35 x 9.6 x 1.9 mm
CertificationCE RED / UKCA / FCC / ISED / MIC
Production statusMass Production
Standard packaging QTY500 pcs
Product comparison

Modules of the series compared

Compare key features and technical specifications of the modules to find the right solution for your application.

-1C Economy-1C Standard-1C Premium-1B Economy-1B Standard-1B Premium
AntennaChipChipChipBottom PadBottom PadBottom Pad
32kHz Crystal
4MB Additional Flash
Part NumberENW89861C01FENW89861B01FENW89861A01FENW89861F01FENW89861E01FENW89861D01F
Rapid evaluation made easy.

Evaluation Board

  • Arduino interface configurable as shield or board
  • mikroBUS interface
  • All GPIOs accessible via pin headers
  • Power measurement interface
  • Segger J-Link on-board debugger
  • Virtual COM port over Segger J-Link on-board debugger
  • Peripherals can be deactivated for low power applications
  • 4x user buttons, 4x user LEDs
  • FPC connector for NFC antenna (antenna is included)
  • Compatible to nRF Connect SDK projects

 

P/NPackage includes
ENW89861AXKF 1x PAN B611-1C Evaluation Board with Chip Antenna
ENW89861DXKF 1x PAN B611-1B Evaluation Board with uFL Connector & 1x W1030 Puls Antenna with cable
Contact us

Request support or certification documents

The PAN B611 is certified for

  • Europe: CE RED
  • UK: UKCA
  • USA: FCC
  • Canada: ISED
  • Japan: MIC

Do you need access to test reports and certification documents for the PAN B611 module? Please fill out the form. Our technical support team will review your request and provide you with the necessary information and files.

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