PAN1316/26C (no/with antenna) HCI Bluetooth 4.1

Panasonic’s new PAN1316/1326 Host Controlled Interface (HCI) Bluetooth Low Energy dual mode module brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to an easy to use module format.

Panasonic’s tiny footprint technology has produced a module of only 85.5mm². The module is designed to accommodate PCBs pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing.
This module has been designed to be 100% pin compatible with the previous generation of Bluetooth Classic devices PAN1315/1325.

This unique design feature provides the possibility to seamlessly switch Bluetooth classic products to Bluetooth low
energy. The PAN1316/1326 connects mobile devices such as cellular phones and small button cell battery powered devices like fitness sensors, watches, and healthcare accessories. It can be easily implemented and creates a data chain from Bluetooth low energy to Bluetooth classic devices.

  • PAN131x stands for module w/o antenna
  • PAN132x stands for module with antenna

General

  • Bluetooth 4.2 compliant up to the HCI Layer
  • Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
  • Fully Qualified Bluetooth, FCC and IC listed, CE compliant
  • Dimensions: 9.0 mm x 9.5 mm x 1.8 mm (width x length x height)
  • Operating Temperature Range: -40°C to +85°C
  • Supply Voltage Range: 1.8 - 4.8 V
  • Based on TI’s CC2564C

 

Interfaces

  • UART
  • GPIO
  • PCM

 

Bluethoot

  • Up to seven active devices, Scatternet: Up to three Piconets simultaneously, one as Master and two as Slaves
  • Up to two Synchronous Connection Oriented (SCO) Links on the ame Piconet
  • Support for All Voice Air-Coding Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power (Multiple Bluetooth Profiles, Multiple Sniff Instances)
  • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Capabilities of Link Layer Topology Scatternet, concurrently as Peripheral and Central, support up to 10 devices
  • Integration of BT 4.2 secure connecting feature implementing ECDH technology

Model

Temp.

Part Number

TI-Device

Remark

PAN1315A

-20°C to +70°C

ENW89829C2JF

CC2560A

NR for new designs

PAN1315A

-40°C to +85°C

ENW89829C2KF

CC2560A

NR for new designs

PAN1315B

-40°C to +85°C

ENW89829C3KF

CC2560B

NR for new designs

PAN1316

-20°C to +70°C

ENW89823C2JF

CC2564

NR for new designs

PAN1316

-40°C to +85°C

ENW89823C2KF

CC2564

NR for new designs

PAN1316C
-40°C to +85°CENW89823C4KFCC2564CRecommended for new design
PAN1316B

-40°C to +85°C

ENW89823C3KF

CC2564B

NR for new designs

PAN1317

-20°C to +70°C

ENW89827C2JF

CC2564

NR for new designs

PAN1317

-40°C to +85°C

ENW89827C2KF

CC2564

NR for new designs

PAN1323

-20°C to +70°C

ENW89842A2JF

CC2564

NR for new designs

PAN1323

-40°C to +85°C

ENW89842A2KF

CC2564

NR for new designs

PAN1325A

-20°C to +70°C

ENW89829A2JF

CC2560A

NR for new designs

PAN1325A

-40°C to +85°C

ENW89829A2KF

CC2560A

NR for new designs

PAN1325B

-40°C to +85°C

ENW89829A3KF

CC2560B

NR for new designs

PAN1326

-20°C to +70°C

ENW89823A2JF

CC2564

NR for new designs

PAN1326

-40°C to +85°C

ENW89823A2KF

CC2564

NR for new designs

PAN1326C
-40°C to +85°CENW89823A4KFCC2564CRecommended for new design
PAN1326B

-40°C to +85°C

ENW89823A3KF

CC2564B

NR for new designs

PAN1327

-20°C to +70°C

ENW89827A2JF

CC2564

NR for new designs

PAN1327

-40°C to +85°C

ENW89827A2KF

CC2564

NR for new designs