Bluetooth

PAN1026A - Bluetooth Basic Data Rate and Low Energy Module

PAN1026A - Bluetooth Basic Data Rate and Low Energy Module

The PAN1026A is based on Toshiba ́s single chip TC35661 Bluetooth semiconductor device with an embedded Toshiba Bluetooth SIG certified stack. The PAN1026A is a highly integrated Dual Mode Bluetooth controller that delivers high-speed operation at ultra-low power consumption. An embedded SPP (Serial Port Profile of Bluetooth Classic) and a GATT (Generic Attribute Profile of Bluetooth LE) stack are integrated. The module significantly reduces external component count and power consumption in applications requiring support of Bluetooth 4.2 standards. The PAN1026A does not support EDR (Enhanced Data Rate) or Central Mode. Details about iAP integration can be provided on request. The integrated EEPROM has a Panasonic MAC address and it can be used to store Link Keys.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
15.6 x 8.7 x 1.8 TC35661 -88 @ BER 10-³ +4 dBm -40 to +85 °C 135µA (sleep) / 40mA (Tx,EDR 2.4 GHz -
PAN1326C - BT Basic Data Rate and Low Energy 4.2 HCI Module

PAN1326C - BT Basic Data Rate and Low Energy 4.2 HCI Module

Panasonic’s new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to an easy-to-use module format. The PAN1326C is Bluetooth-4.2-compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 % pin‑compatible with previous generations of Texas Instruments-based Bluetooth HCI modules.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
9.0 x 9.5 x 1.8 CC2564C -93 @ BER 10-³ +10.5 dBm -40 to +85 °C 135µA (sleep) / 40mA (Tx,EDR) 2.4 GHz -
PAN1760A - Bluetooth Low Energy Module

PAN1760A - Bluetooth Low Energy Module

The PAN1760A is Panasonic’s next generation Bluetooth module with the industry’s lowest power Bluetooth Low Energy SoC. The module is based on Toshiba's single chip TC35678 Bluetooth semiconductor device with embedded Toshiba Bluetooth 4.2 LE stack and embedded flash for the user application in stand-alone operation. Peak power consumption of only 3.3 mA in Tx and Rx mode allows advanced wireless functionalities in IoT, medical, and industrial applications without compromising battery life. Mandatory and optional Bluetooth 4.2 features are supported.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
15.6 x 8.7 x 1.8 TC35667 -91 @ BER 10-³ 0 dBm -40 to +85 °C max Tx 8.7 / Rx 8.4 mA 2.4 GHz -
PAN1026 - BT Classic & Low Energy embedded Dual Mode Module

PAN1026 - BT Classic & Low Energy embedded Dual Mode Module

PAN1026 is based on Toshiba´s single chip TC35661 Bluetooth semiconductor device with embedded Toshiba Bluetooth SIG certified stack. The TC35661 is a highly integrated and compact Bluetooth controller that delivers high-speed operation at ultra-low power consumption. It significantly reduces external component count and power consumption in applications requiring support of Bluetooth 2.1 and 4.0 standards. EDR (enhanced data rate) is not supported. An embedded SPP (Serial Port Profile of Bluetooth Classic) and GATT (Generic Attribute Profile of Bluetooth LE) are also integrated.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
15.6 x 8.7 x 1.8 TC35661-501 -88 @ BER 10-³ +4 dBm -40 to +85 °C 135µA (sleep) / 40mA (Tx,EDR 2.4 GHz -
PAN1316/26 (no/with antenna) HCI Bluetooth 4.1

PAN1316/26 (no/with antenna) HCI Bluetooth 4.1

Panasonic’s new PAN1316/1326 Host Controlled Interface (HCI) Bluetooth Low Energy dual mode module brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to an easy to use module format. Panasonic’s tiny footprint technology has produced a module of only 85.5mm². The module is designed to accommodate PCBs pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing.
This module has been designed to be 100% pin compatible with the previous generation of Bluetooth Classic devices PAN1315/1325.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
9.0 x 6.5 x 1.8 / 9.0 x 9.5 x 1.8 CC2564 -93 @ BER 10-³ +10.5 dBm -40 to +85 °C 135µA (sleep) / 40mA (Tx,EDR) 2.4 GHz -
PAN1555 - Bluetooth V2.0 Embedded

PAN1555 - Bluetooth V2.0 Embedded

Now you can integrate Bluetooth very easily into your final product without qualification, with the PAN1555. It has a serial interface and additional interfaces for integration into your system. The PAN1555 is manufactured in a 13,50*22.75*2,85mm³ SMD package with an integrated ceramic antenna and will be qualified as a Bluetooth 2.0 End Product.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
22.8 x 13.5 x 2.7 BC6 / STM32F103 -86 @ BER 10-³ +4 dBm -40 to +85 °C < 100µA (sleep)
47mA (ACL;DH1)
2.4 GHz -
PAN1720/21 - Bluetooth Low Energy Module

PAN1720/21 - Bluetooth Low Energy Module

This Bluetooth low energy single-mode module has been specially developed for applications which communicate with dual or single mode Bluetooth low energy devices like mobile phones, PDA´s, Laptops etc. So it is very easy to expand your personal area network with this module, using existing gateways. The included Bluetooth low energy stack is currently supporting the proximity and battery profile. The user specific application can be written on top of the Bluetooth Stack. The communication between stack and application is handled via vendor specific HCI-commands. The PAN1720(21)-Module is manufactured in a very small 15.6 x 8.7 x 1.9 mm³ SMD package with shielded case and will be qualified according to the Bluetooth 4.0 standard.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
15.6 x 8.7 x 1.8 CC2540/41 -94 @ BER 1% +3 dBm -40 to +85 °C Tx 23 mA @ -6 dBm / Rx18 mA, sleep < 1 µA 2.4 GHz 1 MBit/s (gross)
PAN1740 - Bluetooth Low Energy 4.1 SoC Module

PAN1740 - Bluetooth Low Energy 4.1 SoC Module

PAN1740 is the next generation Bluetooth Low Energy Module from Panasonic with reduced form factor, significantly lower power consumption and embedded Software Stack. The Singlemode Bluetooth Smart System-on-Chip module is optimized for low power, small size and low system cost products. It reduces external component count, development effort and time to market.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
9.0 x 9.5 x 1.8 Dialog -93 @ BER 1% 0 dBm -40 to +85 °C Tx/Rx 4.9 mA 2.4 GHz 1 MBit/s (gross)
PAN1760 - Bluetooth Low Energy

PAN1760 - Bluetooth Low Energy

The PAN1760 is based on Toshiba's single chip TC35667 Bluetooth semiconductor device with embedded Toshiba Bluetooth 4.1 LE stack and GATT profile. Peak power consumption of only 5.4 mA in Tx mode allows advanced wireless functionalities in IoT, medical, and industrial applications without compromising battery life.The PAN1760 can either be operated in Host mode for very simple integration of Bluetooth connectivity into existing products, or in Stand-Alone mode, where 24 kB RAM is available for the user application. The PAN1760, the PAN1761, and the PAN1026 share the same footprint.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
15.6 x 8.7 x 1.8 TC35667 -91 @ BER 10-³ 0 dBm -40 to +85 °C max Tx 8.7 / Rx 8.4 mA 2.4 GHz -
PAN1761 - Bluetooth Low Energy & NFC Combo Module

PAN1761 - Bluetooth Low Energy & NFC Combo Module

The PAN1761 is based on Toshiba's single chip TC35670 Bluetooth semiconductor device with embedded Toshiba Bluetooth 4.1 LE stack, GATT profile, and an NFC Forum Type 3 compliant NFC tag. Peak power consumption of only 5.8 mA in Tx mode allows advanced wireless functionalities in IoT, medical, and industrial applications without compromising battery life. Additionally, NFC allows products to wake up from zero standby power consumption to full Bluetooth operation. Highly secure Bluetooth connections are created using NFC to exchange link keys.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
15.6 x 8.7 x 1.8 TC35670 -90 @ BER 10-³ 0 dBm -40 to +85 °C typ. Tx 5.5 mA 2.4 GHz -

WiFi

PAN9420 - Fully Embedded Stand Alone Wi-Fi Module

PAN9420 - Fully Embedded Stand Alone Wi-Fi Module

The PAN9420 is a 2.4 GHz 802.11 b/g/n embedded Wi-Fi module with integrated stack and API that minimizes firmware development and includes a full security suite. The module is specifically designed for highly integrated and cost-effective applications. The module includes a fully shielded case, integrated crystal oscillators, and a chip antenna.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Frequency Range
29.0 x 13.5 x 2.66 Marvell -97 @1M-DSSS +16 @11 b -40 °C to +85 °C 2.4 GHz
PAN9020/10 Module Wi-Fi Radio 802.11 b/g/n

PAN9020/10 Module Wi-Fi Radio 802.11 b/g/n

PAN9020/10 is a series of 2.4GHz ISM band wireless radio modules for implementing WLAN functionality into various electronic devices. The cost-effective, low-power operation, system-on-chip (SoC) solutions enable wireless network applications to be built with low total bill-of-material costs.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Frequency Range
22.75 x 13.5 x 2.4 Marvell -98 @1M-DSSS +18@11 b 0 to +70 °C 2.4 GHz
PAN9320 - Fully Embedded Stand-Alone Wi-Fi Module

PAN9320 - Fully Embedded Stand-Alone Wi-Fi Module

The PAN9320 is a 2.4 GHz 802.11 b/g/n embedded Wi-Fi module with integrated stack and API that minimizes firmware development and includes a full security suite. The module is specifically designed for highly integrated and cost-effective applications. The module includes a fully shielded case, integrated crystal oscillators, and a chip antenna.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Frequency Range
29.0 x 13.5 x 2.66 Marvell -98 @1M-DSSS +18@11 b 30 to +70 °C 2.4 GHz

802.15.4 (2.4 GHz)

PAN2355 - ISM Transceiver

PAN2355 - ISM Transceiver

This extremely compact and high-functionality module is mainly intended for the ISM (Industrial, Scientific and Medical) frequency bands at 868 and 915 MHz. Other frequency bands are possible on request. It provide a wireless radio transceiver and can be linked to a wide range of devices including home appliances, keyless entry and many other applications through SPI or UART.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
8.0 x 8.2 x 1.9 CC1101 -104 @ 2.4kBit/s +10 dBm -40 to +85 °C < 1μA (sleep) 17 mA (Tx, 0dBm) 868 MHz & 915MHz 500 kBit/s (gross)
PAN4561 - 802.15.4-Modem

PAN4561 - 802.15.4-Modem

The PAN4561H module is a long range, low power, 2.4 GHz ISM band transceiver which includes a complete 802.15.4 physical layer (PHY) modem, designed for the IEEE 802.15.4 wireless standard and a appropriate microcontroller (MCU) with reference oscillator which provides a cost effective solution for long range data links and networks.

Size (mm) Used ICs Rx Sensitivity (dBm) Tx Power (max.) Operating Temp. Current Consum. Frequency Range Date Rate (max. air)
35.0 x 15.0 x 3.8 MC1321x/CC259x -102 @ 250kBit/s +18.5 dBm -40 to +85 °C Tx: 30mA @-4dBm 2.4 GHz 250 kBit/s (gross)