PAN1326C - BT Basic Data Rate and Low Energy 4.2 HCI Module

Panasonic’s new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to an easy-to-use module format. The PAN1326C is Bluetooth-4.2-compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 % pin‑compatible with previous generations of Texas Instruments-based Bluetooth HCI modules.

General

  • Bluetooth 4.2 compliant up to the HCI Layer
  • Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
  • Fully Qualified Bluetooth, FCC and IC listed, CE compliant
  • Dimensions: 9.0 mm x 9.5 mm x 1.8 mm (width x length x height)
  • Operating Temperature Range: -40°C to +85°C
  • Supply Voltage Range: 1.8 - 4.8 V
  • Based on TI’s CC2564C

 

Interfaces

  • UART
  • GPIO
  • PCM

 

Bluetooth

  • Up to seven active devices, Scatternet: Up to three Piconets simultaneously, one as Master and two as Slaves
  • Up to two Synchronous Connection Oriented (SCO) Links on the ame Piconet
  • Support for All Voice Air-Coding Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power (Multiple Bluetooth Profiles, Multiple Sniff Instances)
  • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Capabilities of Link Layer Topology Scatternet, concurrently as Peripheral and Central, support up to 10 devices
  • Integration of BT 4.2 secure connecting feature implementing ECDH technology

Part Number

Description                     

Remark

ENW89823C4KF

PAN1316C

-40°C to +85°C; TI Device CC2564C

Recommended for new designs

ENW89823A4KF

PAN1326C

-40°C to +85°C; TI Device CC2564C

 Recommended for new designs

ENW89829C2JF

PAN1315A

-20°C to +70°C; TI Device CC2560A

Not recommended for new designs

ENW89829C2KF

PAN1315A

-40°C to +85°C; TI Device CC2560A

Not recommended for new designs

ENW89829C3KF

PAN1315B

-40°C to +85°C; TI Device CC2560B

Not recommended for new designs

ENW89823C2JF

PAN1316

-20°C to +70°C; TI Device CC2564

Not recommended for new designs

ENW89823C2KF

PAN1316

-40°C to +85°C; TI Device CC2564

Not recommended for new designs

ENW89823C3KF

PAN1316B

-40°C to +85°C; TI Device CC2564B

Not recommended for new designs

ENW89827C2JF

PAN1317

-20°C to +70°C; TI Device CC2564

Not recommended for new designs

ENW89827C2KF

PAN1317

-40°C to +85°C; TI Device CC2564

Not recommended for new designs

ENW89842A2JF

PAN1323

-20°C to +70°C; TI Device CC2564

Not recommended for new designs

ENW89842A2KF

PAN1323

-40°C to +85°C; TI Device CC2564

Not recommended for new designs

ENW89829A2JF

PAN1325A

-20°C to +70°C; TI Device CC2560A

Not recommended for new designs

ENW89829A2KF

PAN1325A

-40°C to +85°C; TI Device CC2560A

Not recommended for new designs

ENW89829A3KF

PAN1325B

-40°C to +85°C; TI Device CC2560B

Not recommended for new designs

ENW89823A2JF

PAN1326

-20°C to +70°C; TI Device CC2564

Not recommended for new designs

ENW89823A2KF

PAN1326

-40°C to +85°C; TI Device CC2564

Not recommended for new designs

ENW89823A3KF

PAN1326B

-40°C to +85°C; TI Device CC2564B

Not recommended for new designs

ENW89827A2JF

PAN1327

-20°C to +70°C; TI Device CC2564

Not recommended for new designs

ENW89827A2KF

PAN1327

-40°C to +85°C; TI Device CC2564

Not recommended for new designs

 

PAN1326C - Daughterboard (Order-No. ENW89819AXKF)
Single PAN1326C Daughterboard - can only be used in combination with the TI MSP430 Launchpad and the TI Boost/ CCEMAdapter. It is to enable the Development of the TI BT-Stack for MSP430.

PAN1326C - Experimenter Kit (Order-No. ENW89819AYKF)
This Experimenter Kit contains TI MSP430 Launchpad, TI PAN1326C Adapter Board and a TI Boost/ CCEM Adapter. It is to enable the Development of the TI BT-Stack for MSP430.

Further information on the Texas Instruments Development platforms:
http://processors.wiki.ti.com/index.php/CC256x